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Electronic Packaging of High Speed Circuitry

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Click here to buy Electronic Packaging of High Speed Circuitry by  Stephen G. Konsowski and Arden R. Helland.  

Electronic Packaging of High Speed Circuitry

by Stephen G. Konsowski and Arden R. Helland
5.0 out of 5 stars

  • Hardcover: 345 pages
  • Publisher: McGraw-Hill Professional; 1 edition May 1, 1997
  • Language: English
  • ISBN: 0070359709
  • Product Dimensions: 9.3 x 6.3 x 1.4 inches
  • Shipping Weight: 1.76 pounds

    0 of 1 people found the following review helpful: Great for understanding the field !, August 22, 2001 Reviewer:"rouchard" (Attleboro, Ma. USA) - Only made it to 2nd chapter so far, but very informative in the understanding of the field for someone just beginning the world of high speed packaging with concise explanations.

    Book Description
    With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.

    Book Info
    Comprehensive guide to the packaging of high speed circuits for today's advanced electronic products. Provides practical design guidelines plus information on the major issues of design and performance evaluation. DLC: Electronic packaging.

    © Adapt, Inc. 1998-2006








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